Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

VRM: Using a virtual sample to diagnose defects

Posted: 18 Nov 2002     Print Version  Bookmark and Share

Keywords:verification  ic packaging  pqfp  vrm  c-sam 

This technical article details how an advanced acoustic technique makes it possible to create a "virtual package" that preserves the full 3D detail of an IC package as a matrix file.

View the PDF document for more information.



Comment on "VRM: Using a virtual sample to diagn..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top