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EE Times-India > Manufacturing/Packaging

VRM: Using a virtual sample to diagnose defects

Posted: 18 Nov 2002     Print Version  Bookmark and Share

Keywords:verification  ic packaging  pqfp  vrm  c-sam 

This technical article details how an advanced acoustic technique makes it possible to create a "virtual package" that preserves the full 3D detail of an IC package as a matrix file.

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