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EE Times-India > EDA/IP

Co-design methodology for system interconnect

Posted: 17 May 2004     Print Version  Bookmark and Share

Keywords:co-design  interconnect  pcb  i/o  vsic 

This article outlines a co-design methodology supported by a unique platform that enables design and analysis of the electronic system interconnect from IC to IC, across packages, connectors, backplanes and PCBs.

View the PDF document for more information.

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