2014-03-11-20 Article review - EE Times-India

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EE Times-India Home > Article review > 2014-03-11-20

Article review (Sorted By Date)

India extends IT, business expertise to East Timor (20/03/14) [ Networks ]
Ray tracing makes its way into mobile devices (20/03/14) [ Processors/DSPs ]
Erbium-doped fibre amplifiers target CATV apps (20/03/14) [ Amplifiers/Converters ]
Green Hills Software expands certified functional safety sol'ns (20/03/14) [ Embedded ]
SoC debug IP accelerates system validation, software dev't (20/03/14) [ EDA/IP ]

Limiting post amps support up to 12.5Gb/s for ONU/ONT apps (20/03/14) [ Amplifiers/Converters ]
TI intros wireless network range extender (20/03/14) [ RF/Microwave ]
Imagination's ray tracing promises better mobile graphics (20/03/14) [ Processors/DSPs ]
KitKat-compliant sensors boast excellent power efficiency (20/03/14) [ Sensors/MEMS ]
Google unveils Android Wear Developer Preview (20/03/14) [ Embedded ]

What you need to know about batteries (Part 1) (20/03/14) [ Power/Alternative Energy ]
12A synchronous buck regulator features PMBus interface (19/03/14) [ Power/Alternative Energy ]
Input converters deliver 300W from 5-300VDC (19/03/14) [ Power/Alternative Energy ]
Comm module aimed at Real-Time Ethernet slave apps (19/03/14) [ Networks ]
Through-hole Micro USB connectors target 1.6mm PCBs (19/03/14) [ Networks ]

Reference design claims to reduce cost of e-bike Li-ion cells (19/03/14) [ EDA/IP ]
Novel cell metallization cuts solar module cost (19/03/14) [ Power/Alternative Energy ]
Device cloaks objects from sonar, sound detection (19/03/14) [ Manufacturing/Packaging ]
Nissan, Renault to bring together prod'n capabilities (19/03/14) [ Manufacturing/Packaging ]
Issues in shifting from single to multi-core (19/03/14) [ Embedded ]

Using LM3478/LM3488 evaluation board (19/03/14) [ Power/Alternative Energy ]
Emerging telecom industry drives investments into Myanmar (18/03/14) [ Networks ]
NXP rolls SENT-compliant angular sensor (18/03/14) [ Sensors/MEMS ]
PMICs offer low consumption for 5-100W AC/DC power supplies (18/03/14) [ Power/Alternative Energy ]
Dissecting trends in RF device space (18/03/14) [ RF/Microwave ]

Sony, Panasonic develop archive disc supporting up to 1TB (18/03/14) [ Memory/Storage ]
Multi-function electrical installation testers unveiled (18/03/14) [ T&M ]
Stanford study to scrutinise U.S. patent system (18/03/14) [ EDA/IP ]
Standard phone charger aims to reduce e-waste (18/03/14) [ Power/Alternative Energy ]
Advances in auto infotainment systems (18/03/14) [ Embedded ]

Address cross-wire faults in e-metering networks (18/03/14) [ T&M ]
Analyst: Embedded tech, IoT to boost connectivity reach (17/03/14) [ Embedded ]
LTE deployments in China to fuel rise in RF device sales (17/03/14) [ Amplifiers/Converters ]
Si photonic modulator transmits data at 28GHz (17/03/14) [ RF/Microwave ]
CEA-Leti builds 16nm self-aligned split-gate memory (17/03/14) [ Memory/Storage ]

Intelligent active damper eliminates torsional vibrations (17/03/14) [ Embedded ]
Cadence keynote centres on expansive systems design (17/03/14) [ EDA/IP ]
U.S. regulations, key to embedded V2X deployment (17/03/14) [ Embedded ]
Novel laser opens path for silicon photonics (17/03/14) [ Manufacturing/Packaging ]
Organic PV cells reach 8.4% conversion efficiency (17/03/14) [ Power/Alternative Energy ]

Minimise metastability with User Grey Cell approach (17/03/14) [ EDA/IP ]
Measuring PSRR accurately (17/03/14) [ T&M ]
ClariPhy CMOS SoC brings 100G Ethernet to data centres (14/03/14) [ Networks ]
Fujitsu reveals support technology for cloud systems (14/03/14) [ Embedded ]
Dialog unveils latest audio codec (14/03/14) [ Manufacturing/Packaging ]

SiC MOSFETs promise energy efficient designs (14/03/14) [ Power/Alternative Energy ]
Tungsten diselenide-based LEDs push miniaturisation limits (14/03/14) [ Manufacturing/Packaging ]
2D material aimed at next-gen optoelectronics (14/03/14) [ Manufacturing/Packaging ]
NXP, trade unions approve collective pay rise (14/03/14) [ Manufacturing/Packaging ]
Maxim ready to take on IoT space, says CEO (14/03/14) [ Embedded ]

Analyst: LED die prod'n in China to climb 37% (14/03/14) [ Manufacturing/Packaging ]
PMA to release latest specs for car wireless charging (14/03/14) [ RF/Microwave ]
How to implement SoC with 50% duty cycles (14/03/14) [ Embedded ]
FMEA for TPS386000-Q1 pins (14/03/14) [ Power/Alternative Energy ]
China's weak economy hurts outlook for its IC market (13/03/14) [ Manufacturing/Packaging ]

Global battlefield management systems to hit $12.6B by 2019 (13/03/14) [ Embedded ]
Test sol'ns geared for wireless mobile devices (13/03/14) [ T&M ]
High speed transceiver aimed at data centre apps (13/03/14) [ Networks ]
3A load switches support 1.7-5.5V voltage range (13/03/14) [ Power/Alternative Energy ]
MCUs from LAPIS target sensor management, IoT apps (13/03/14) [ Controls/MCUs ]

Transistors promise to cut PCB space by half (13/03/14) [ Power/Alternative Energy ]
Xilinx unveils OTN reference designs (13/03/14) [ EDA/IP ]
ADI commences biennial student fellowship programme (13/03/14) [ EDA/IP ]
Using position sensors for throttle valve systems (13/03/14) [ Sensors/MEMS ]
Xilinx rolls high performance DDR4 memory devices (12/03/14) [ Memory/Storage ]

Bosch MEMS sensors target airbags, car safety apps (12/03/14) [ Sensors/MEMS ]
LGTmedical announces smartphone app oximeter (12/03/14) [ Sensors/MEMS ]
Wireless sensor networks IoT market to reach $12B in 2020 (12/03/14) [ RF/Microwave ]
Source-measure unit claims faster sampling rate (12/03/14) [ T&M ]
Handheld device aimed at CAN bus diagnostics (12/03/14) [ T&M ]

Active-Semi intros wireless mobile charging sol'n (12/03/14) [ RF/Microwave ]
Novel technologies offer flexible WANs with SDN (12/03/14) [ RF/Microwave ]
Asia ahead of Europe in 2013 installed PV capacity (12/03/14) [ Manufacturing/Packaging ]
Performing sine/cosine-to-digital conversion (12/03/14) [ Amplifiers/Converters ]
I2C comm sample code for BqMaximo with CRC option (12/03/14) [ Power/Alternative Energy ]

ADI touts low-power 18bit ADCs (11/03/14) [ Controls/MCUs ]
AMD debuts latest AM1 platform (11/03/14) [ Processors/DSPs ]
TI extends MCU platform for IoT apps (11/03/14) [ Controls/MCUs ]
32bit MCUs integrate 512KB flash memory (11/03/14) [ Controls/MCUs ]
NXP, pushing NFC app design to the mainstream (11/03/14) [ RF/Microwave ]

NXP JV in China bets high on domestic EV market (11/03/14) [ Manufacturing/Packaging ]
Xilinx to unleash 16nm UltraScale MPSoCs (11/03/14) [ Processors/DSPs ]
Understanding the micropipeline (11/03/14) [ Embedded ]

--- Total 83 records ---

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