2011-05-11-20 Article review - EE Times-India

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EE Times-India Home > Article review > 2011-05-11-20

Article review (Sorted By Date)

China tops solar cell production (20/05/11) [ Power/Alternative Energy ]
Sequans, Ericsson team on global TD-LTE development (20/05/11) [ RF/Microwave ]
Notebook market to pick up by Q2 2011 (20/05/11) [ Manufacturing/Packaging ]
3D TV market shows 500% boom (20/05/11) [ Manufacturing/Packaging ]
Intel's pitch lacks credibility (20/05/11) [ Embedded ]

India's first smart grid project gets IBM aid (20/05/11) [ Power/Alternative Energy ]
USB 3.0-to-SATA controllers read at 265MB/s (20/05/11) [ Interface ]
Optocouplers boast 50% smaller package size (20/05/11) [ Amplifiers/Converters ]
Ballast controller cuts 30% external components (20/05/11) [ Controls/MCUs ]
Augmented Reality Platform readied for Android phones (20/05/11) [ Embedded ]

Renesas, Imagination extend graphic tech licenses (19/05/11) [ Optoelectronics/Displays ]
NFC to take mobile payments by storm (19/05/11) [ RF/Microwave ]
Auto navigation market seeks low cost solutions (19/05/11) [ Embedded ]
NXP ventures into IP-based light bulbs (19/05/11) [ RF/Microwave ]
Intel revamps Atom road map to counter ARM (19/05/11) [ EDA/IP ]

Intel: Windows 8 splits for ARM (19/05/11) [ Embedded ]
Fibre-based laser source targets microscopy apps (19/05/11) [ Optoelectronics/Displays ]
MOSFET array core comes in low-magnetic package (19/05/11) [ Amplifiers/Converters ]
Automated test system designed for MIL-STD 461 (19/05/11) [ T&M ]
Single-layer sensor cuts capacitive touchscreen cost (19/05/11) [ Optoelectronics/Displays ]

Video shoots up global data traffic (18/05/11) [ RF/Microwave ]
Internet surfing tops desirable phone app (18/05/11) [ Embedded ]
AMD presents cloud adoption research (18/05/11) [ Networks ]
OpenCores aims for 'super-low-cost' ASIC design (18/05/11) [ EDA/IP ]
HP innovates memristor technology (18/05/11) [ Memory/Storage ]

Analyst: No ARM for AMD (18/05/11) [ Processors/DSPs ]
Resistors with thermal fuse guard video displays (18/05/11) [ Power/Alternative Energy ]
Integrated optical film manages LCD backlight (18/05/11) [ Optoelectronics/Displays ]
LED concept provides CRI above 90 (18/05/11) [ Optoelectronics/Displays ]
Ambient light sensor automates brightness adjustment (18/05/11) [ Sensors/MEMS ]

Mobile printing sees surging demand (17/05/11) [ Embedded ]
CMOS image sensor sales gain momentum (17/05/11) [ Optoelectronics/Displays ]
TSMC collaborates with Sematech for IC process tech (17/05/11) [ EDA/IP ]
Rambus gains chip security technology firm (17/05/11) [ Embedded ]
Google TV seeks apps (17/05/11) [ Embedded ]

Stretchable sensors enable safety applications (17/05/11) [ Sensors/MEMS ]
RF amplifiers claim ultra-small package size (17/05/11) [ Amplifiers/Converters ]
NAND Flash controller complies with ONFI 3.0 (17/05/11) [ Controls/MCUs ]
Digital temperature sensor aids thermal profiling (17/05/11) [ Sensors/MEMS ]
IC packs PFC, ballast control (17/05/11) [ Power/Alternative Energy ]

Android captures 35% of smartphone OS market (16/05/11) [ Embedded ]
SpringSoft adds verification tech to functional qualification (16/05/11) [ EDA/IP ]
Resistor networks target signal conditioning apps (16/05/11) [ Power/Alternative Energy ]
MLC NAND chip packs 64Gb, DDR 2 interface (16/05/11) [ Memory/Storage ]
4-channel squib driver prevents accidental airbag deployment (16/05/11) [ Controls/MCUs ]

Network-attached storage unit shipments on the rise (16/05/11) [ Networks ]
Cadence launches online EDA store (16/05/11) [ EDA/IP ]
GSA confirms LTE investment by 80 countries (16/05/11) [ RF/Microwave ]
MEMS-based VCXOs claim 10x better linearity (16/05/11) [ Amplifiers/Converters ]
MPUs target high-bandwidth network apps (16/05/11) [ Processors/DSPs ]

Mirrorless camera establishes ground (13/05/11) [ Optoelectronics/Displays ]
Embedded modules falter against USB modems (13/05/11) [ Interface ]
IHS: Tri-gates give Intel an edge over ARM (13/05/11) [ Processors/DSPs ]
Android to get unified, USB support (13/05/11) [ Embedded ]
Google's Chromebook stiffens competition for Windows (13/05/11) [ Embedded ]

Renesas Mobile launches India R&D centre (13/05/11) [ RF/Microwave ]
Single-IC sensor signal conditioner targets auto apps (13/05/11) [ Sensors/MEMS ]
Software updates optimise DSP multi-core design (13/05/11) [ Processors/DSPs ]
CompactRIO platform adds integrated systems (13/05/11) [ Embedded ]
Micro PMIC designed for Li-Ion powered devices (13/05/11) [ Power/Alternative Energy ]

Cadence enhances Silicon Realisation with Altos buy (12/05/11) [ EDA/IP ]
Researchers characterise superconductivity (12/05/11) [ Power/Alternative Energy ]
MCU supply chain still in trouble (12/05/11) [ Manufacturing/Packaging ]
LTE subscribers spurt to 20.5 crore by 2014 (12/05/11) [ RF/Microwave ]
Is GoogleTV back on? (12/05/11) [ Embedded ]

Broadcom to buy security software developer (12/05/11) [ Networks ]
SuperSpeed USB 3.0 PHY IP achieves certification (12/05/11) [ EDA/IP ]
System Host Board supports USB3.0, SATAIII (12/05/11) [ Interface ]
PXI digitizers offer high-speed signal acquisition (12/05/11) [ T&M ]
10 DoF MEMS sensor enables advanced navigation (12/05/11) [ Sensors/MEMS ]

IEEE group explores Ethernet future (11/05/11) [ RF/Microwave ]
ARM to capture 13% PC processor share by 2015 (11/05/11) [ Processors/DSPs ]
PC processor market projects 17.6% growth (11/05/11) [ Processors/DSPs ]
Infineon aims at energy efficiency, mobility, security (11/05/11) [ Manufacturing/Packaging ]
Interactive paper computer debuts (11/05/11) [ Optoelectronics/Displays ]

Nvidia buys Icera, strengthens mobile strategy (11/05/11) [ RF/Microwave ]
Energy-efficient SBC targets rugged apps (11/05/11) [ Embedded ]
16bit FRAM MCUs write 100x faster (11/05/11) [ Controls/MCUs ]
Ref s/w dev't toolchain revised for ARM processors (11/05/11) [ Controls/MCUs ]
Audio SoC supports up to 50W, cuts external heatsink (11/05/11) [ Amplifiers/Converters ]

--- Total 80 records ---

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