Article review (Sorted By Date)
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VoIP-enabled chipset touts low power consumption
(20/04/09) [ Networks ]
- Low-power SRAM extends battery life (20/04/09) [ Power/Alternative Energy ]
- Made in India: Portable DVB-T/H middleware (20/04/09) [ Embedded ]
- MCU suits size constrained consumer apps (20/04/09) [ Embedded ]
- 1.1-A USB charger comes with 50-mA LDO (20/04/09) [ Power/Alternative Energy ]
- Low-end CPUs get big push from HP, Dell (20/04/09) [ Embedded ]
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Analyst: 450mm will be a disaster
(20/04/09) [ Manufacturing/Packaging ]
- Report: NEC Elec, Renesas in merger talks (20/04/09) [ Embedded ]
- Funding crisis threatens innovation (20/04/09) [ Manufacturing/Packaging ]
- Crossing the chasm: The tale of Cswitch (20/04/09) [ Embedded ]
- Large-sized panel shipments up 27.8% MoM (20/04/09) [ Manufacturing/Packaging ]
- Microchip aims to 'elbow out' MCU rivals (17/04/09) [ Embedded ]
- In-Stat sees 20% drop in handset shipments (17/04/09) [ RF/Microwave ]
- Worldwide PC shipments down in Q1 (17/04/09) [ Embedded ]
- Breakthrough in Si-based all-optical ICs reported (17/04/09) [ Amplifiers/Converters ]
- Analyst: Low Atom margins hit Intel again (17/04/09) [ Embedded ]
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China, India defy downturn in wireless arena
(17/04/09) [ RF/Microwave ]
- Outsourcing slowdown hurts Infosys sales (17/04/09) [ Manufacturing/Packaging ]
- Schottky rectifiers offer low thermal resistance (17/04/09) [ Power/Alternative Energy ]
- NetLogic rolls Layer 7 content processor (17/04/09) [ Embedded ]
- Small POL converters boast 93% efficiency (17/04/09) [ Power/Alternative Energy ]
- Lighting mgt unit shortens handset design time (17/04/09) [ Power/Alternative Energy ]
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Parallel computing tools get new versions
(17/04/09) [ Embedded ]
- MEMS to lead component revolution (16/04/09) [ Embedded ]
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RAPID technique advances nanofabrication process
(16/04/09) [ Optoelectronics/Displays ]
- Jedec publishes new MMC V4.4 standard (16/04/09) [ Embedded ]
- Samsung dominates new iPod shuffle design (16/04/09) [ Embedded ]
- A closer look at Dialog (16/04/09) [ Manufacturing/Packaging ]
- NIST scientists create ion-trap junctions (16/04/09) [ Embedded ]
- HDD initiative launched in India (16/04/09) [ Memory/Storage ]
- Power controller provides 250 picoseconds PWM (16/04/09) [ Embedded ]
- VoWiFi ref design achieves 20-hour talk time (16/04/09) [ Embedded ]
- Receivers enable CW Doppler processing (16/04/09) [ Amplifiers/Converters ]
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Cavium unveils next-gen network processor
(16/04/09) [ Embedded ]
- Full-chip synthesis tool for advanced ICs upgraded (16/04/09) [ EDA/IP ]
- Low pin count 8-bit MCUs target consumer apps (16/04/09) [ Embedded ]
- SP3T switches offer low distortion (16/04/09) [ Amplifiers/Converters ]
- Buck regulator features wide input voltage range (16/04/09) [ Power/Alternative Energy ]
- Philips shuts down 3-D TV biz (16/04/09) [ Optoelectronics/Displays ]
- TFT LCD fab utilisation drops to all-time low (16/04/09) [ Optoelectronics/Displays ]
- Survey: Firms still plan to push IT initiatives (16/04/09) [ Networks ]
- Battery monitor eyes lithium-ion apps (15/04/09) [ Power/Alternative Energy ]
- 45nS comparators offer low quiescent current (15/04/09) [ Power/Alternative Energy ]
- 110-nm ASIC platform cuts NRE costs (15/04/09) [ EDA/IP ]
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Startup takes MLC to server flash drives
(15/04/09) [ Embedded ]
- Dual-N band router targets India (15/04/09) [ RF/Microwave ]
- Cable assemblies are hand formable (15/04/09) [ Amplifiers/Converters ]
- ARM devt suite offers new enhancements (15/04/09) [ Embedded ]
- Buck converter comes with integrated inductor (15/04/09) [ Power/Alternative Energy ]
- ARM netbooks struggle with Web video, software (15/04/09) [ Embedded ]
- Chip market to plunge 26% this year (15/04/09) [ Manufacturing/Packaging ]
- SMPTE 3DTV effort to kick off in June (15/04/09) [ Optoelectronics/Displays ]
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GPUs vs. CPUs for EDA simulations
(15/04/09) [ EDA/IP ]
- MIT method could lead to narrower chip patterns (15/04/09) [ Embedded ]
- Tektronix acquires Arantech (15/04/09) [ RF/Microwave ]
- ASML rises to No.2 in fab tool rankings (15/04/09) [ T&M ]
- Freescale: No sale of wireless unit yet (15/04/09) [ RF/Microwave ]
- Tight supply drives NAND spot prices up (15/04/09) [ Memory/Storage ]
- PC vendors adopt green strategies (14/04/09) [ Embedded ]
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SEMI India presents vision for solar market
(14/04/09) [ Power/Alternative Energy ]
- Coming soon: Android set-tops, TVs, VoIP phones (14/04/09) [ Embedded ]
- Research study centres on silver niobate (14/04/09) [ RF/Microwave ]
- OEM, EMS sectors fuel Indian SMT market (14/04/09) [ Manufacturing/Packaging ]
- Transimpedance amp flaunts low noise performance (14/04/09) [ Amplifiers/Converters ]
- Smart card interface offers low-power stop mode (14/04/09) [ Interface ]
- Intel launches 2GHz Atom processor (14/04/09) [ Embedded ]
- DC/DC modules designed for industrial apps (14/04/09) [ Power/Alternative Energy ]
- Electrical design software gets an upgrade (14/04/09) [ EDA/IP ]
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32-bit flash MCUs feature 200 MHz operation
(14/04/09) [ Embedded ]
- PIN photodiode touts enhanced UV sensitivity (14/04/09) [ Optoelectronics/Displays ]
- Optical modules reduce testing cost (14/04/09) [ Amplifiers/Converters ]
- IC market to rebound in second half of '09 (14/04/09) [ EDA/IP ]
- Research seeks to extend solar cell lifetime (14/04/09) [ Power/Alternative Energy ]
- Marvell's quest: Connecting the next billion users (14/04/09) [ Embedded ]
- Server board features Intel quad-core processors (13/04/09) [ Embedded ]
- Tiny GPS receiver rolls for timing apps (13/04/09) [ Embedded ]
- C interface to LabVIEW FPGA now available (13/04/09) [ Embedded ]
- 7W diode laser suits medical applications (13/04/09) [ Optoelectronics/Displays ]
- Platform delivers faster verification (13/04/09) [ EDA/IP ]
- Pentek unveils multi-frequency clock synthesiser (13/04/09) [ Embedded ]
- Wireless groups finalise femtocell standards (13/04/09) [ RF/Microwave ]
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'Moore's Law is running out of gas'
(13/04/09) [ EDA/IP ]
- IT courses launched for Indian engineers (13/04/09) [ Embedded ]
- Netbooks bring good news to display suppliers (13/04/09) [ Manufacturing/Packaging ]
- Building tomorrow's smart grid (13/04/09) [ Networks ]
- 3-D nanofluidic device developed (13/04/09) [ EDA/IP ]
- PHY IC targets ULC mobile comms (13/04/09) [ RF/Microwave ]
- HPA touts dual-sided bias architecture (13/04/09) [ Amplifiers/Converters ]
- ABI: Users prefer Wi-Fi-enabled phones (13/04/09) [ RF/Microwave ]
- Where memory vendors went wrong (13/04/09) [ Memory/Storage ]
--- Total 90 records ---
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