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MEMS devices arrive at 300mm-diameter wafers

Posted: 30 Sep 2015     Print Version  Bookmark and Share

Keywords:CEA-Leti  wafer  MEMS  piezo-resistive  accelerometer 

CEA-Leti, a French research institute, has developed accelerometer MEMS devices on 300mm-diameter wafers. This is considered as the first example of 300mm wafer MEMS production and sheds some light on the direction that the MEMS sector will one day take to minimise cost.

The wafer was presented by Jean-Rene Lequepeys, head of Leti's silicon components division, at the European MEMS Summit.

CEA-Leti used its piezo-resistive silicon nanowire technology, which allows the fabrication of three-axis accelerometer, three-axis gyroscope, three-axis magnetometer and pressure sensor on the same chip. The technology is being transferred to Tronics Microsystems SA that only manufactures on 200mm wafers. CEA-Leti described the demonstration of the technology on 300mm-diameter wafers as showing "very promising results."

MEMS devices on 300mm-diameter wafers

The compatibility of Leti's 200mm-developed technologies with 300mm wafer fabrication, "shows a significant opportunity to cut MEMS production costs," said Leti CEO Marie Semeria. "This will be especially important with the worldwide expansion of the Internet of Things and continued growing demand for MEMS in mobile devices."

In addition to lowering costs, manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of 3D through-silicon-vias (TSV), which is already available in 300mm technology.

When asked at the European MEMS Summit when TSMC would be moving to 300mm-diameter wafer production Kees Joosse, director for business development in Europe, said: "Not any time soon."

- Peter Clarke
  EE Times Europe





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