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Car radio processors offer cut-and-paste design integration

Posted: 10 Nov 2014     Print Version  Bookmark and Share

Keywords:Accordo2  processor  STA1095 

STMicroelectronics unveiled a new generation of processors of car radio and display audio applications. The devices claim to deliver an unprecedented level of hardware and software integration to enable fast system implementation.

The Accordo2 family offers a fully integrated audio sub-system, including media decoding, audio routing, sound processing, and analogue audio inputs and outputs, as well as an independent secure CAN microcontroller sub-system. Until now, car infotainment manufacturers had to use multiple devices to achieve the same result that a single Accordo2 device delivers today, according to the company.

In addition to minimising the BOM, Accordo2 facilitates faster product development, with a so-called complete turnkey software solution that includes middleware, media players, audio codecs and sound-effect processing. Moreover, the various members of the family offer application scalability to design a basic car radio all the way up to Connected-Car Radio and Display-Audio applications, while reducing engineering costs by reusing the same hardware and software architectures for all use-case scenarios.

"The hardware and software integration that we have built into Accordo2 unleashes unprecedented levels of creativity for customers because they can 'cut and paste' our reference design and then modify it quickly to create their own branded products," said Antonio Radaelli, Infotainment Business Unit director at STMicroelectronics.

Accordo2 devices include a 32bit ARM Cortex R4 core, running at up to 600MHz, to handle all media management, connectivity and audio-decoding functions. The flagship product, STA1095, incorporates an additional ARM Cortex M3 controller dedicated to real-time CAN/Vehicle interface processing, as well as a powerful Digital Signal Processor (DSP) that supports sound-enhancing algorithms as well as Echo Noise Cancellation (ECNR) for Bluetooth hands-free phone calls.

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STA1095 block diagram. (Source: STMicroelectronics)

All Accordo2 devices are housed in LFBGA 361-ball (16mm x 16mm x 1.7mm, 0.8mm pitch) packages. Samples are currently available, with volume production scheduled for the second quarter of 2015.





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