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Advanced mat'ls help mobile devices dissipate heat faster

Posted: 29 Sep 2014     Print Version  Bookmark and Share

Keywords:Honeywell Electronic Materials  smartphone  tablet  thermal interface material 

Honeywell Electronic Materials has revealed that its advanced materials are being used in the production of tablets and smartphones, helping them stay cool and perform better. According to the company, various mobile electronics manufacturers are using its thermal interface materials (TIMs) to dissipate the intense heat produced by increasingly powerful chips at the heart of these devices. If not managed properly, the heat can lead to performance issues and even cause the devices to stop performing altogether.

"End users demand a lot from their devices and our materials help manufacturers manage heat that can threaten performance and longevity," said David Diggs, VP and GM of Honeywell Electronic Materials. "Our TIM product offerings, which are based on more than a half century of knowledge developing materials for the semiconductor industry, are helping device manufacturers meet the growing expectations as mobile devices continue to be central to everyday life."

Honeywell claims to be a recognised leader in developing thermal management solutions that transfer and dissipate heat from advanced semiconductor devices. Its proven PTM and PCM series of thermal management materials are based on sophisticated phase-change chemistry and advanced filler technology that was developed specifically for high-performing electronic devices.

TIMs technology from Honeywell transfers thermal energy from the chip to the heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chip cool while allowing the heat sink module to perform optimally.

Honeywell's unique, proprietary and patented formulations provide long-lasting chemical and mechanical stability, enabling consistently higher thermal performance compared with alternative thermal interface materials that break down or dry out.

This stability has been proven through the industry's most widely accepted accelerated aging tests including: extended baking at 150°C; thermal cycling from -55°C to 125°C; and the highly accelerated stress test (HAST). Honeywell's TIM offerings meet aggressive thermal needs such as thin bond line capability, low thermal impedance and long-term reliability.





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