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0.65mm pitch flip chip BGA package reference guide

Posted: 06 Aug 2014     Print Version  Bookmark and Share

Keywords:flip chip  microelectronic  integrated circuit  IC  interconnection 

The term flip chip describes the method of electrically connecting the die to the package substrate. Flip chip microelectronic assembly is the direct electrical connection of face-down (or flipped) integrated circuit (IC) chips onto substrates, circuit boards or carriers using conductive bumps on the chip bond pads. In contrast to wire-bonding technology, flip chip technology uses a conductive bump directly on the die surface to make the interconnection between the die and carrier. The bumped die is flipped and placed face down so that the bumps connect directly to the carrier.

View the PDF document for more information.

Originally published by Texas Instruments Inc. at www.ti.com as "0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide".





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