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Soft-termination MLCCs boast high flex cracking resistance

Posted: 28 Apr 2014     Print Version  Bookmark and Share

Keywords:TDK  MLCC  board stress  PCB  capacitor 

TDK Corp. has unveiled a series of soft-termination MLCCs geared to endure flex cracking caused by bending stresses to the PCB. The commercial grade MLCCs are available in case sizes from EIA 0402 (1 x 0.5mm) to EIA 3025 (7.5 x 6.3mm) and with a wide range of capacitance values on a par with TDK's other commercial grade MLCCs, added the company.

PCBs are exposed to mechanical bending stress during a number of handling processes such as board splitting, insertion of sockets and leaded components, and screw-down, which take place after the MLCCs are mounted on the board. These mechanical stresses can cause flex cracking in the MLCCs. In order to effectively absorb these board stresses, TDK has designed the devices with an elastic conductive resin electrode material and advanced electrode forming technology. The result is a soft termination that is able to withstand a board deflection of up to 5mm (over a length of 90mm), making the joint 2.5 times stronger than that of standard MLCCs, and all but eliminates the risk of flex cracking.

The series of commercial grade soft-termination MLCCs extends TDK's portfolio of components with outstanding joint reliability, the company stated. Together with the MEGACAP Type series of capacitors with metal lead frames, TDK offers a broad range of MLCCs that are able to withstand severe environmental conditions.

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According to TDK, the devices are aimed at electronic circuits whose PCBs require handling after MLCCs have been soldered such as smartphones, PCs, TVs, power supplies, game consoles, car multimedia equipment and base stations.

With these types the soft-termination technology already proven in automotive grade components of the CGA series is available for general-purpose applications as well. Mass production will start in July 2014.





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