Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > Controls/MCUs
 
 
Controls/MCUs  

TI extends MCU platform for IoT apps

Posted: 11 Mar 2014     Print Version  Bookmark and Share

Keywords:Texas Instruments  Internet of Things  MCU  Ethernet  cloud 

Texas Instruments (TI) has expanded its MCU LaunchPad ecosystem with the introduction of the Tiva C Series Connected LaunchPad. The Internet of Things (IoT) platform claims to enable engineers and makers to rapidly prototype a range of cloud-enabled applications, bringing wide connectivity to any new or existing LaunchPad-based application, added the firm.

The Tiva C Series TM4C1294NCPDT MCU on-board adds advanced Ethernet technology and the largest memory footprint available in the LaunchPad ecosystem, TI stated. The robust performance and diverse peripherals on this platform can run multiple communication stacks simultaneously, allowing engineers to develop network gateways that can connect multiple endpoints to the cloud. Example applications include sensor gateways, home automation controllers, industrial communication/control networks and cloud-enabled gadgets/appliances.

Tiva C Series TM4C1294NCPDT MCU

Along with the on-board Ethernet MAC+PHY, significant analog integration and connectivity options, the Tiva C Series Connected LaunchPad contains two BoosterPack XL plug-in interfaces. These interfaces allow designers to connect to a wide range of compatible BoosterPacks, providing the capability to expand application reach with sensors, displays, wireless modules and more.

The Tiva C Series Connected LaunchPad can connect and communicate with products and services using on-board 10/100 Ethernet MAC+PHY with advanced-line diagnostics for smart identification of cabling issues. The integrated CAN and USB provide high-speed connectivity, allowing the creation of seamless gateway solutions. In addition, it offers control outputs and manages multiple events such as lighting, sensing, motion, display and switching, using sensor aggregation capabilities with 10 I2C ports, two fast accurate 12bit ADCs, two quadrature encoder inputs, three on-chip comparators, external peripheral interface and advanced pulse-width modulation (PWM) outputs.

The series allows the use of on-board cloud solution to remotely interact with applications running on the Tiva C Series Connected LaunchPad(s). It also enables the designer to maximize the value of IoT applications with scalable cloud technologies and visual analytics. These enable designers to connect remotely through a web browser or custom application to manage the Tiva C Series Connected LaunchPad and real-time data. Likewise, the Tiva C Series Connected LaunchPad can interconnect to standard breadboards for easy prototyping with the I/O grid array using industry-standard headers, and can regulate application power levels with on-board TI analog: TPS2052BDRBR (fault-protected power switch, dual-channel) and TPS73733DRV (3.3 LDO fixed out and 5V in).

A large ecosystem of BoosterPack plug-in modules allow various application extensions. Developers can use TI's SimpleLink Wi-Fi CC3000 BoosterPack, SimpleLink Bluetooth low energy CC2541-based BoosterPack from Anaren, as well as many other TI and third- party BoosterPack solutions. Included with the Tiva C Series Connected LaunchPad is an extensive TivaWare software foundation with more than 50 accompanying software application examples, accelerating software development time and allowing developers to concentrate on delivering differentiated products to the market more quickly.

The Tiva C Series Connected LaunchPad (EK-TM4C1294XL) is available for $19.99 through the TI estore and licensed TI distributors.





Comment on "TI extends MCU platform for IoT apps"
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top