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U-blox collaborates with Intel on HSPA module

Posted: 21 May 2013     Print Version  Bookmark and Share

Keywords:U-blox  HSPA  module  Intel  3G 

Swiss-based u-blox is collaborating with Intel to bring a small, cost-effective 3G-only HSPA module to the market. The companies aim to sell a 3G-only module that’s about the size of a quarter.

Based on Intel's XMM 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with u-blox' SARA 2G and LISA 3G module series.

u-blox' 2G-3G-4G nested design philosophy allows product designers to offer tailored solutions to their target markets based on a single PCB design.

"The XMM 6255 platform is latest innovation by Intel and specifically designed for M2M," said Horst Pratsch, head of product line modules and M2M at Intel Corporation. "Integrating the 3G power amplifier in the transceiver delivers the smallest possible size and lowest number of components enabling new applications of 3G in machine-to-machine applications. Intel is pleased to work with u-blox in bringing this solution to the market."

Based on Intel X-GOLD 625 digital- and analogue-baseband with integrated Power Management Unit and the Intel SMARTi UE2p transceiver for 3G, the Intel XMM 6255 platform is the smallest available HSPA modem chipset. Its compact size and powerful HSPA performance enables u-blox to create the world's smallest dedicated 3G modem module dedicated to operation over 3G networks worldwide.





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