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ARM Cortex-A57 processor on TSMC's 16nm FinFET tech ready for tape-out

Posted: 03 Apr 2013     Print Version  Bookmark and Share

Keywords:16nm FinFET process  ARM Cortex-A57 processor  OIP design ecosystem  ARMv8 processor 

ARM Holdings plc and Taiwan Semiconductor Manufacturing Company Ltd (TSMC) have announced the first tape-out of an ARM Cortex-A57 processor on FinFET process technology.

This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64bit ARMv8 processor series on TSMC FinFET process technologies. The two companies cooperated in the implementation from RTL to tape-out in six months using ARM Artisan physical IP, TSMC memory macros, and EDA technologies enabled by TSMC's Open Innovation Platform(OIP) design ecosystem.

According to the companies, their collaboration produces optimized, power-efficient Cortex-A57 processors and libraries to support early customer implementations on 16nm FinFET for high-performance, ARM technology-based SoCs.

"This first ARM Cortex-A57 processor implementation paves the way for our mutual customers to leverage the performance and power efficiency of 16nm FinFET technology," said Tom Cronk, executive vice president and general manager, Processor Division, ARM. "The joint effort of ARM, TSMC, and TSMC's OIP design ecosystem partners demonstrates the strong commitment to provide industry-leading technology for customer designs to benefit from our latest 64-bit ARMv8 architecture, big.LITTLE processing and ARM POP IP across a wide variety of market segments."

"Our multi-year, multi-node collaboration with ARM continues to deliver advanced technologies to enable market-leading SoCs across mobile, server, and enterprise infrastructure applications," said Cliff Hou, TSMC vice president of R&D. "This achievement demonstrates that the next-generation ARMv8 processor is FinFET-ready for TSMC's advanced technology."

The announcement highlights the enhanced and intensified collaboration between ARM and TSMC. The test chip was implemented using a commercially available 16nm FinFET tool chain and design services provided by the OIP ecosystem and ARM Connected Community partners. The successful collaborative milestone is confirmation of the roles that TSMC's OIP and ARM's Connected Community play in promoting innovation for the semiconductor design industry, the companies noted.





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