Infineon ships first power ICs made on 300-mm wafer
In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-mm line at the Villach (Austria) site, according to the company.
"300-mm thin-wafer manufacturing for power semiconductors will enable us, with the corresponding demand, to seize the opportunities that the market offers," Reinhard Ploss, CEO, Infineon Technologies said.
The larger size of 300-mm wafer compared to 200-mm wafers used as standard for power IC production means two-and-a-half times as many chips can be made from each one.
Infineon plans to add the approval of its back-end packaging site in Malacca, Malaysia and then to expand production to its front-end site in Dresden, Germany, where a fully automated 300-mm production line will focus on high volume production.
The technology transfer to Dresden is running on schedule and qualification of the first CoolMOS products will be completed in March. Shortly, in Villach more power semiconductor technologies will be transferred to the 300mm line and produced. The development of the next power technology generation will focus on 300 instead of 200mm technology, Infineon added.
"300-mm thin-wafer technology guarantees that in the future Infineon will continue to be able to produce sufficient quantities at competitive costs."
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