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Altera, TSMC develop 3D IC test vehicle

Posted: 23 Mar 2012     Print Version  Bookmark and Share

Keywords:3D IC  Chip-on-Wafer-on-Substrate  CoWoS 

Altera Corporation and TSMC have announced the joint development of a heterogeneous 3D IC test vehicle using TSMC's Chip-on-Wafer-on-Substrate (CoWoS) integration process.

CoWoS is an integrated process technology that attaches device silicon chips to a wafer through a chip on wafer (CoW) bonding process. The CoW chip is attached to the substrate (CoW-On-Substrate) to form the final component. By attaching the device silicon to the original thick wafer silicon before it finishes the fabrication process, manufacturing-induced warping is avoided. TSMC plans to offer CoWoS as a turnkey manufacturing service.

Altera is the first semiconductor company to develop and complete characterisation of a heterogeneous test vehicle using TSMC's CoWoS process, the company said. This and additional test vehicles enable Altera to quickly test the capabilities and reliability of 3D ICs to ensure they meet yield and performance targets.

"TSMC's CoWoS process combined with Altera's technology leadership in silicon and intellectual property (IP) lays the foundation for rapid and cost-effective 3D IC product development and deployment in the future."

"Our partnerships with standards bodies like IMEC and SEMATECH, and our use of TSMC's leading-edge CoWoS manufacturing and assembly process put us in an excellent position to execute on our strategy of delivering heterogeneous 3D devices to our customers at the right time and with the right set of features," said Bill Hata, senior vice president of worldwide operations and engineering at Altera. "Implementing heterogeneous 3D capabilities into our devices enables us to continue our path of technology innovation and leadership, and carry us beyond Moore's Law."





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