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Flip-chip tech gains renewed interest

Posted: 20 Apr 2011     Print Version  Bookmark and Share

Keywords:flip-chip packages  flip-chip market growth  wire bonding  flip-chip applications 

Market research firm, Yole Développement believes that the flip-chip market is still in a growth phase, despite the fact that it looks like a mature market at first glance. Major flip-chip technology and application, and supply chain transformations loom ahead, according to the analysts.

A new report by the market research firm reveals that flip-chip packages were worth about Rs.73,059.36 crore ($16 billion) by the end of 2010, making up 13 per cent of all IC packages and more than 29 per cent of the global IC assembly, packaging and test market.

"Renewed interest in flip-chip technologies is motivated in many application areas concurrently by such factors as the rising cost of gold used for wire bonding, the need for low-thickness devices, continued CMOS downscaling, higher currents and temperatures and lower voltages," said Christophe Zinck, a project manager at Yole, in a statement.

Today, many sophisticated devices can no longer be packaged with wire bonding technology and mobile applications increasingly require footprint and weight reduction coupled with higher electrical performance, according to Yole. The emergence of 28nm CMOS technology poses new quality and reliability constraints on interconnect technologies so as to cope with the increasing fragility of the back end of line, which may disqualify wire bonding, Yole said.

Ever-increasing IO density is also making it necessary to develop new bumping and substrate technologies, Yole added, warning that these constraints could prove to be obstacles to the continuation of Moore's Law if not resolved.

2010 Total flip-chip market value

Figure 1: 2010 Total flip-chip market value.

- Dylan McGrath
  EE Times





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