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Stereo audio codec improves loudspeaker performance

Posted: 15 Sep 2010     Print Version  Bookmark and Share

Keywords:stereo audio codec  loudspeaker  portable multimedia 

Maxim Integrated Products debuts the MAX98088, an integrated stereo audio codec that claims improved loudspeaker performance by optimising the signal level and frequency response, while limiting the maximum distortion and power at the output to prevent speaker damage.

MAX98088

Using Maxim's FLEXSOUND technology, the MAX98088 combines a high audio performance with low 5.6mW power consumption targeting portable multimedia, smartphones and mobile phone applications.

The MAX98088 provides an extensive toolkit for improving loudspeaker playback performance and voice transmission. The easy-to-use evaluation (EV) kit and user interface simplify evaluation of the FLEXSOUND tools: 5-band parametric EQ, automatic level control (ALC), speaker excursion limiter, speaker power limiter, and speaker distortion (THD) limiter. These tools enable system designers to easily optimise audio performance while limiting distortion and power at the output.

Microphone automatic gain control (AGC) and a noise gate optimise the signal level of microphone input signals to make the best use of the ADC dynamic range and improve voice conversion.

The integrated headphone amplifiers feature Maxim's dual-mode charge pump and Class H output stage to maximise efficiency. This architecture eliminates the need for large output capacitors and ensures click-/pop-free operation during turn-on, turn-off, and volume changes. Ground sense reduces the output noise caused by ground-return current.

The stereo Class D speaker amplifiers feature Maxim's ultra-low-EMI, high-efficiency, and filterless technology. These amplifiers output 950mW into 8Ω speakers while maintaining 87 per cent efficiency. These capabilities offer improved battery life, reduction of external components, and provide ample sound-pressure level for mobile products.

The MAX98088 is available in a space-saving (3.8mm x 3.3mm, 0.4mm pitch) 63-bump wafer-level package (WLP). It is fully specified for operation over the -40°C to +85°C extended temperature range. An EV kit is available, complemented by Linux and other OS platform software drivers. Prices start at Rs.92.46 ($1.98) (1000-up, FOB USA).





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