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Flowable chemical vapour deposition aids 20nm design

Posted: 30 Aug 2010     Print Version  Bookmark and Share

Keywords:chemical vapour deposition  FCVD  dielectric film 

Applied Materials Inc. unveils the Applied Producer Eterna flowable chemical vapour deposition (FCVD) system that it claims is capable of electrically isolating the densely-packed transistors in 20nm-and-below memory and logic chip designs with a high-quality dielectric film. The gaps between transistors at this node can have aspect ratios of more than 30:1—five times higher than current requirements—and highly-complex profiles.

The Eterna FCVD system completely fills these gaps from the bottom up, delivering a dense, carbon-free dielectric film using less process steps and offering half the cost of spin-on deposition methods.

"The need to fill smaller and deeper structures in advanced chip designs creates a physical roadblock for existing deposition technologies.", notes Bill McClintock, VP and general manager of the DSM/CMP2 business unit of Applied Materials.

The Eterna FCVD process delivers a liquid-like film that flows freely into virtually any structure shape to provide a bottom up, void-free fill. The system is installed at six customer sites for DRAM, flash and logic applications, where it is integrated on Applied's benchmark Producer platform.





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