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Layout and design guidelines for the MC13883

Posted: 03 Mar 2010     Print Version  Bookmark and Share

Keywords:PCB footprint guideline  MC13883 guidelines  QFN40 package charger 

This application note describes guidelines for a PCB footprint for the QFN40 package used for the MC13883 integrated charger. Included are layouts of the component copper layer, solder mask and solder paste stencil. These recommendations are guidelines only and may need to be modified depending on the assembly house used and the other components on the board.

View the PDF document for more information.





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