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AMC module targets test, DSP processing apps

Posted: 08 Jan 2010     Print Version  Bookmark and Share

Keywords:AMC module  advanced mezzanine card  Serial RapidIO  DSP 

CommAgility is expanding its processing sub-systems with a new advanced mezzanine card (AMC) module. The AMC-3D74 includes a front panel mounted Serial RapidIO (SRIO) interface, and provides a cost-effective, high-performance solution for test equipment and general purpose DSP processing applications.

Multiple 10Gbps SRIO interfaces are provided for radio cards and any customer-specific I/O requirements. The SRIO interfaces are also accessible via the AdvancedMC backplane, and optical I/O can be provided as an option. The AMC-3D74 also provides Gigabit Ethernet and RocketIO via the AMC backplane.

The AMC-3D74 is a single width, full-size PICMG AMC module. For high processing density, it is based around three TMS320C6474 multi-core DSPs from Texas Instruments Incorporated (TI), running at 1 or 1.2GHz, and a Virtex-5 FPGA from Xilinx.

"We are delighted to see CommAgility supporting our TMS320C6474 processor in a high-performance AdvancedMC module," said Mukesh Kumar, marketing manager for TI's communications infrastructure business. "This is an essential step in providing an OEM-ready product in this form factor."

Edward Young, managing director at CommAgility, said, "This new module provides nine DSP cores and a powerful FPGA to give excellent processing performance—coupled with the front panel Serial RapidIO interface that is required for certain customer applications."

A range of build options are available, and further customisation is possible in volume, to enable the best technical and commercial fit to a customer application to be achieved. The new module has been tested and proven with a range of third-party software, which reduces system development costs and helps cut time to market for OEMs.

CommAgility's AdvancedMC modules have proved successful in high-performance processing applications, particularly wireless telecoms. Its AMC-3C87F3 module, which includes three TCI6487 DSPs from TI, has secured multiple design wins and is now shipping in volume.

The AMC-3D74 is available now.





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