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Correct mounting for Flangeless packages

Posted: 03 Jul 2009     Print Version  Bookmark and Share

Keywords:heat sink  thermal resistance  mounting procedure 

The correct mounting of any power device to the heat sink is an important step in obtaining the manufacturer's published specifications. On average, almost one half of the RMΘJHS is the thermal resistance of the thermal compound layer.

The article details the recommended device to heat sink mounting procedure for any devices in the Flangeless package family.

View the PDF document for more information.





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