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Power FPGA-based systems with DC/DCµModule, Part 2

Posted: 14 May 2009     Print Version  Bookmark and Share

Keywords:DC/DCµModule  power supply  heat management 

Delivering 60W of power in a compact space without efficient means to remove the heat from the power supply worsens the already difficult task of system heat management and cooling. The DC/DCµModule family is designed with careful attention to the layout of its internal components, package type and electrical operation, which ease thermal management of a very dense power supply circuit. The LGA package and simple layout allow 100 per cent surface mountable and low profile design for maximum efficiency in air flow. This new approach in power supply design takes advantage of paralleling multiple DC/DCµModule regulators and following a copy and paste approach in layout design, to provide a 60W power supply with minimum components while operating efficiently in a compact and low profile space.

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