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Processor improves PA efficiencies

Posted: 17 Feb 2009     Print Version  Bookmark and Share

Keywords:digital signal processor  pre-distortion transmit processor  PA efficiency 

Texas Instruments (TI) has announced a new single-chip wideband digital pre-distortion transmit processor that enables OEMs to improve power efficiency and reduce the overall power consumed by wireless basestations.

TI's GC5325 combines a crest factor reduction block (CFR) and a digital pre-distortion block (DPD) to improve power amplifier (PA) efficiencies to more than 25 per cent for Class AB PAs and more than 40 per cent for Doherty PAs.

The flexible GC5325 supports multiple PA architectures, multi-mode operation, and various air interface standards including: CDMA2000, WCDMA, TD-SCDMA, OFDMA (WiMAX, LTE), HSPA, and HSPA+.

The GC5325 DPD transmit architecture incorporates a TI floating point digital signal processor (DSP) to implement the advanced linearisation algorithm which relaxes multi-carrier power amplifier design specifications and increases PA operating efficiencies. The new device has greater than 100 MHz of DPD bandwidth which allows for correction of over 20 MHz of 5th order distortion products.

System level performance can be evaluated in the manufacturer's design with the easy-to-use GC5325 system evaluation kit (GC5325SEK). Engineers can measure PA efficiency, Error Vector Magnitude (EVM), Peak-to-Average Ratio (PAR), and Adjacent Channel Leakage Ratio (ACLR). In addition, customers can save four man months of development time by leveraging the GC5325SEK architecture to implement their own design. The GC5325SEK consists of a dual-transmitter architecture, supporting transmit diversity, multiple-input and multiple-output (MIMO), and beamforming for smart antenna applications.

The GC5325 uses a composite base band input consisting of single or multiple carriers combined into a single digital signal, allowing customers to leverage their existing Digital Up-conversion (DUC) IP as well as TI's complete signal chain solutions for communications infrastructure applications. The GC5325SEK utilises TI's TMS320C6727 low-cost, floating-point DSP in addition to the DAC5682z (1GHz dual interpolating DAC), ADS6149 (Low power 14-bit, 250 MSPS ADC), and TRF3703 (400 MHz—4 GHz IQ Modulator).

The GC5325 is released for production and priced at Rs.4,425.01 ($89) per 1K units. The GC5325SEK will be available for ordering in March 2009 and priced at Rs.2.49 lakh ($4,999).





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