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Power/Alternative Energy  

Manage heat dissipation with 'green' solutions

Posted: 29 Jan 2009     Print Version  Bookmark and Share

Keywords:Heat dissipation  green  component cooling 

Heat dissipation is growing problem for telecom service providers, who need to reduce operating expenses and meet growing government demands for "green" compliance. Heat dissipation must be approached from both the component and system architecture standpoint, making it a recurring issue for both OEMs and silicon vendors. While silicon vendors are constantly looking at new technologies designed to reduce power (and thus heat) OEMs are constantly evaluating new air-flow approaches and various component cooling approaches.

Regardless of the solutions, anyone who has spent time around a central office has their own story of the "hot component" ranging from a simple capacitor to power-hungry CPUs. Whatever the offending component or influencing factor—be it the final design which includes noise levels in the central office; the cost of the cooling design; or the amount of air conditioning—there are some basic options which are available to the semiconductor industry as a whole to manage heat dissipation.

View the PDF document for more information.





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