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RF chips for LTE, 3G roll

Posted: 20 Jan 2009     Print Version  Bookmark and Share

Keywords:RF transceiver  LTE  digital base band  3G 

SMARTi LU

From Infineon Technologies AG comes the new SMARTi LU single-chip providing 2G/3G/Long Term Evolution (LTE) functionality with a DigRF digital base band interface for high data rates up to 150Mbps in LTE networks.

The second generation in its LTE RF transceiver family, the SMARTi LU is a highly integrated 2G/3G/LTE multi-mode RF transceiver compliant to 3GPP Rel.7 and Rel.8. It supports up to six 3G and LTE bands simultaneously with Quad Band GSM/EDGE. It also features LTE FDD class 4 (up to 150Mbps downlink, 50Mbps uplink) MIMO Rx diversity (2Rx + 1Tx), HSPA+, HSPA, W-CDMA and GSM/GPRS/Edge. The device also supports the global spread of HSPA/LTE spectrum throughout a wide variety of bands.

With its MIPI DigRF v4 compliant high-speed digital Base band interface, SMARTi LU sets a milestone towards "all digital" implementation and enables the silicon intensive base band chips to follow a faster shrink path towards smaller technology nodes such as 32nm and below. SMARTi LU is based on a standard 65nm CMOS technology provided by multiple semiconductor foundries.

Infineon also unveiled the 3rd generation of its 3G RF transceiver family, the SMARTi UEmicro optimised for lowest cost 3G designs and enables an RF-system e-BOM for dual band W-CDMA/Edge as low as $6.50. That's about 40 per cent lower than available solutions on the market.

The SMARTi UEmicro is a single chip 2G/3G CMOS RF transceiver for the low end segment of the 3G market. It is a cost down version of the proven and widely adopted SMARTi UE with a backward compatible hard- and software interface via DigRF v3.09.

With the elimination of external LNA's and a simplified co-banded RF frontend without Rx filters, SMARTi UEmicro matches the mass market requirements for ultra low cost 3G handsets. SMARTi UEmicro also delivers RF performance for up to three of the globally used W-CDMA bands plus dual- or quad-band GSM/Edge at lowest system cost. Customer sampling is slated by Q2 09, mass production is planned for end of 2009.





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