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Process techs to enhance silicon chips

Posted: 19 Aug 2008     Print Version  Bookmark and Share

Keywords:process technologies  silicon chips  strained silicon  radiation-hard 

IQE plc has added two technologies to its portfolio of manufacturing processes.

The two process technologies are aimed at improving the speed and power consumption of silicon chips by using strained silicon and sapphire for the RF wireless and broadband markets. The radiation-hard attributes of these advanced materials also make them useful for aerospace applications. Future developments could also see these products being used as advanced microcontrollers for industrial, consumer and automotive devices, IQE said.

"One of these new processes has already been fully qualified with a key customer and will go into production immediately," said Moz Fisher, operations manager of IQE Silicon. "The second process requires some significant product re-engineering by the customer, which will extend the qualification period but is expected to be in volume production in the next two years."

The processes were developed with funding assistance from the Welsh Assembly Government in line with their SMART development programmes.

IQE's silicon epitaxy operation manufactures silicon wafers with buried-layer epitaxy, strained silicon on SOI and sapphire, multi-layer and selective epitaxy as well as germanium and SiGe epitaxy.

- Peter Clarke
EE Times Europe





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