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EDA/IP  

Moving into the wireless design mainstream with RF SiP

Posted: 05 Sep 2006     Print Version  Bookmark and Share

Keywords:RF SiP implementation  SoC 

Design processes can be quickened with the combination of best practices and deployment of a co-design methodology and associated technology platform based on the RF SiP implementation methodology.

RF SiP implementation provides a new packaging platform with the advantages of high flexibility, lower cost, and faster cycle time than SoC implementation. SiP technology enables integration of digital and logic ICs, RF ICs, and passives into a single package in a cost-effective process.

View the PDF document for more information.





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