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Inventor develops flip chip-assembly method

Posted: 30 Apr 2008     Print Version  Bookmark and Share

Keywords:flip chip  semiconductor device assembly 

Singaporean inventor Teck Kheng Lee has discovered a method of assembling a flip chip semiconductor device.

The U.S. Patent & Trademark Office relates the invention to a "method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate having a plurality of recesses formed therein."

The Patent Office released an abstract of the invention that says: "The semiconductor die is mounted to the interposer substrate with the conductive bumps disposed in the plurality of recesses so that the die face is adjacent the facing surface of the interposer substrate. One or more openings may be provided in an opposing surface of the interposer substrate which extends to the plurality of recesses and the conductive bumps disposed therein. Dielectric filler material may then be introduced through the one or more openings to the recesses and, optionally, between the semiconductor die and interposer substrate."

The patent has been assigned to Micron Technology Inc., Boise, Idaho.





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