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Infineon Dresden to make Al to Cu switch

Posted: 17 Apr 2008     Print Version  Bookmark and Share

Keywords:aluminium  copper  conductive path  200mm wafers 

Infineon Technologies AG will switch production in its Dresden, Germany fab from aluminium to copper conductive path technology. Along with the conversion, it will expand its manufacturing capacity and save 110 jobs endangered by Qimonda's plans to cut back on Dresden production.

The move is the result of consultations with the worker's council, explained a company spokesperson. After Infineon memory chip subsidiary Qimonda had announced to cut back on the production of 200mm wafers in Dresden last November, Infineon in lockstep had to cut about 600 production jobs. Of these jobs, 110 can be saved through this investment.

For 2009 and 2010, Infineon will invest about Rs.189.52 crore ($47 million) on top of the existing budget. The investment will be used to convert the logic chip production to the advanced copper technology. The installation of the equipment will increase the productivity, boosting the capacity from presently 8,000 wafer starts per month to 8,500 wafer starts per month. The Dresden facility process 200mm wafers.

In addition, the company plans to establish a wafer test centre in Dresden.

- Christoph Hammerschmidt
EE Times Europe





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