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Moisture vs. plastic-packaged ICs

Posted: 04 Apr 2008     Print Version  Bookmark and Share

Keywords:acoustic imaging  delamination  corrosion 

Moisture from the atmosphere can have significant impact on the long-term reliability of a plastic-packaged component mounted on a board. Moisture, which is always accompanied by various contaminants, can cause electrical failures in two ways: by generating cracks and by promoting corrosion.

Tom Adams discusses the mechanics of faults supported by acoustic images. View the PDF document for more information.





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