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RF/Microwave  

How to succeed the first time with ultra-small QFN packages

Posted: 31 Oct 2007     Print Version  Bookmark and Share

Keywords:QFN  SMT  802.15.4 

The QFN form factor delivers a number of advantages over other SMT package form factors. It is generally a smaller part and, with the centre pad, can have better grounding and thermal properties. These advantages are partially offset by layout and assembly difficulties. Like it or not, designers using the new RF standards, such as 802.15.4 and the upcoming 802.11n will have to learn how to effectively utilise these small packages. By following a few simple guidelines, you can use the parts with confidence.

View the PDF document for more information.





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