Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > RF/Microwave
 
 
RF/Microwave  

65nm mobile TV SoC combines decoder, RF chip

Posted: 15 Feb 2008     Print Version  Bookmark and Share

Keywords:65nm single-chip mobile TV SoC  channel decoder  RF chip  worldwide TV standards 

A 65nm single-chip mobile TV SoC which combines a channel decoder with an RF chip has been announced by Samsung Electronics Co. Ltd. Samsung's S3C4F60 supports all worldwide TV standards with respect to frequency range and channel bandwidth, giving consumers the ability to enjoy real-time news, sports, weather forecasts, and live entertainment anywhere.

"As consumers begin to embrace mobile TV, mobile service providers and telecommunication carriers will increase their offerings in a variety of new services aimed at improving customer retention and building new revenue streams," said Yiwan Wong, VP marketing team, System LSI division, Semiconductor Business, Samsung Electronics. "Samsung's S3C4F60 is the most advanced mobile TV receiver solution in the market in providing device manufacturers the flexibility to support the most popular mobile TV standards and broadcast frequency spectrums around the world using a single platform."

Spec compliance
The receiver chip supports six different mobile TV standards and complies with all related specifications of DVB-H/T (ETSI EN 300 744, EN 302 304, EN 301 192 and MBRAI); ISDB-T (ARIB-B29/ B31 1/ 3-Seg); T-DMB [Korean T-DMB, DAB (Eureka-147)]; and DAB/ DAB-IP standards. The integrated built-in multi-band RF tuner supports VHF III (174-240 MHz), UHF (470-862 MHz), and L-bands (1350-1750 MHz).

Samsung's S3C4F60 also offers a significant boost in mobile performance. By achieving 180Hz Doppler frequency performance at DVB-H 16 QAM, 8K, 2/3 CR, and 1/4 GI, mobile TV products using the S3C4F60 can achieve perfect reception of digital TV signals, even inside high-speed trains like the TGV, ICE, or Shinkansen traveling at speeds of up to 300Km/hour.

Fabricated in Samsung's advanced 65nm process and housed in a 5-by-5mm wafer level chip scale package (WL-CSP) to minimise the footprint, Samsung's new S3C4F60 integrates into a single chip a LNA, embedded SRAM, ADC, PLL, ARM 7 CPU and a low drop-out regulator, thereby greatly reducing the number of external components needed.

According to market research firm Strategic Analytics, the mobile TV market is expected to reach 2.4 crore units in 2008 and 13.3 crore units by 2011, for a compounded annual growth rate of 67 per cent.

Samsung's S3C4F60 is scheduled for mass production in the third quarter of 2008 and samples will be available from March, 2008.




Comment on "65nm mobile TV SoC combines decoder,..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top