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IMEC, CNSE collaborate to boost EUVL

Posted: 23 Jan 2008     Print Version  Bookmark and Share

Keywords:extreme ultraviolet lithography (EUVL)  collaboration  nanoelectronics 

Extreme ultraviolet lithography (EUVL) experiments will be carried out in collaboration by Belgian research group IMEC and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany in Albany, New York, as a means to accelerate the introduction of EUVL into manufacturing.

The first set of collaborative experiments will be carried out at CNSE's Albany NanoTech Complex, with future joint studies to be conducted at CNSE and IMEC, depending on the throughput and availability of the tools.

The joint effort will also involve scientists from IBM and ASML, which has built the world's first full-field EUVL R&D tool, the Alpha Demo Tool (ADT).

The majority of activities will focus on the advanced imaging capabilities of the EUVL system, with additional effort devoted to the understanding of new materials and various aspects of equipment technology.

The goal of the participants is to demonstrate the practical feasibility of EUVL and build confidence in the technology for the 32nm half pitch device node and below.

CNSE VP and chief administrative officer Alain Kaloyeros said, the R&D partnership has a huge opportunity "to enable significant advances in EUVL technology that are vital to the manufacturing of future generations of nanoelectronics devices."

Meanwhile, Luc Van den hove, Executive VP and COO at IMEC, commented: "EUV lithography is a promising solution to further scale CMOS beyond the 32nm but still major challenges need to be overcome. As a leading nanoelectronics R&D centre, IMEC sets up collaborations to enhance further semiconductor development.

"This collaboration between IMEC and the UAlbany NanoCollege proves again that joint R&D is a major benefit for the semiconductor industry worldwide. We look forward to building a great partnership with the UAlbany NanoCollege to advance the state of the art in nanoscale lithography."

Kurt Ronse, Lithography Program Director at IMEC, commented that since EUV is still in a development phase, "the alpha demo tools have to be upgraded occasionally. By opening our facilities for each others EUV experiments, we can guarantee acceleration of EUV research to our industrial partners."

He added the accord reached between the participants is a "win-win" situation for all involved in the program.

In mid 2006, a minor war of statements ensued between the CNSE and IMEC about which facility received the world's first full-field R&D EUV tool from ASML Holding NV.

- John Walko
EE Times Europe




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