Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > RF/Microwave
 
 
RF/Microwave  

FDK rolls multilayer chip baluns for WiMAX apps

Posted: 19 Mar 2007     Print Version  Bookmark and Share

Keywords:WiMAX  mobile WiMAX  baluns  FDK  xx 

FDK Corp. has developed four multi-layer chip baluns for WiMAX and mobile WiMAX applications.

Baluns in the AMB1608C series, which consists of the 2500Z05, 2500Z10, 3600Z05 and 3600Z10 devices, measure 1.6-by-0.8-by-0.6mm with low insertion loss of 0.6dB and frequencies of 2.5GHz and 3.6GHz.

The company said the baluns can achieve low insertion loss in this package size due to its low temperature firing material and multi-layer pattern techniques.

The multi-layer chip baluns match impedance between equilibrium and non-equilibrium circuits in RF devices designed in WiMAX communications equipment such as mobile phones, PDAs and car navigation systems.

The baluns comply with the European Union's RoHS directives.

Samples of the AMB1608C series baluns will ship April 2007.

- Ismini Scouras
eeProductCenter




Comment on "FDK rolls multilayer chip baluns for..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top