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Infineon announces power efficient chip solutions

Posted: 14 Feb 2007     Print Version  Bookmark and Share

Keywords:Infineon Technologies  DVB-H/T  chip solutions  OmniViaT TUS9090  OmniTuneT TUA9000 

Infineon Technologies has announced two highly integrated, power-efficient DVB-H/T chip solutions: OmniViaT TUS9090 and OmniTuneT TUA9000. OmniViaT TUS9090 is a fully integrated SoC that includes the RF Tuner, DVB-H/T demodulator and integrated memory. OmniTuneT TUA9000 is a direct-conversion multi-band Silicon Tuner (VHF, UHF as well as the L-Bands for Europe and North America) for the reception of both DVB-H and the DVB-T Digital TV transmission signals.

These products target mobile digital TV applications such as mobile phones, PDA's, mobile media players and laptops. Enabling miniaturisation of electronics system design, the two new Infineon solutions will drive towards lower system costs, reduced power consumption and eventually an increased adoption rate of Mobile TV technology and applications.

According to the research firm In-Stat, the market for mobile TV applications is expected to reach more than 1.8 crore users by the end of 2007. The firm also predicts worldwide users will exceed 13 crore by 2010.

The OmniViaT TUS9090 is a fully integrated SoC front-end for the multi-band worldwide reception of DVB-H/T signals, integrating the RF Silicon Tuner, DVB-H/T demodulator as well as on-chip memory with support for multiple service reception. In time-slicing mode with 10 per cent duty cycle, the OmniViaT TUS9090 operates at less than 50mW, making this device highly power efficient.

Manufactured using the Infineon's 130nm CMOS RF technology, the OmniViaT TUS9090 is available packaged at a dimension of only 8-by-8-by-0.8mm. Optionally, it can also be provided as bare die (bumped flip chip) which enables handheld device manufacturers to integrate it directly into modules and thus achieve an extremely low profile of less than 1mm.

The OmniViaT TUS9090 is currently sampling with key customers. General samples will be available by the Q4 CY 2007, with mass production scheduled for early CY 2008.




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