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NXP sets up 'first' die-level failure analysis centre in Taiwan

Posted: 24 Jan 2007     Print Version  Bookmark and Share

Keywords:NXP Semiconductors  IC analysis 

Beefing up its Asian operations, NXP Semiconductors will put up Asia's first and its second die-level failure analysis centre in Taiwan. The die-level failure analysis centre, to be established in March, will undertake inoperative IC analysis to service faster their Asian customers. To achieve this, the Taiwan centre will work closely with the failure analysis centre and R&D team in Europe. The new centre will house advanced facilities such as field emission microscope, dual beam FIB, optical beam induced resistance change and 3D X-ray analytical system.

The die-level failure analysis centre will initially employ 10 engineers, with about 100 more to be recruited through time. Selected personnel will be trained in Europe for at least two years to transfer the know-how to the Taiwan and advanced further the professional level of local talent.

"With a solid history of incubating local talents in assembly and testing, NXP is realising our commitment to elevate Taiwan's strategic role among the global semiconductor markets," said H.C. Lu, Taiwan CEO of NXP Semiconductors. "Our goal is to provide a zero time-zone customer service network and to upgrade the level of Asia's other manufacturing sites by establishing Asia's first die-level failure analysis centre in Kaohsiung. The decision to locate the die-level failure analysis centre in Taiwan reflects NXP's commitment in developing the Asian market over the long term, promoting the development of the Taiwan semiconductor industry and developing the talent this industry needs."

NXP will also establish in Taipei a product test and development centre to address increasing demands in digital home and mobile communications in Asia. The company will invest Rs.27.19 crore ($6 million) for talent development and advance facility upgrades within its existing testing assembly site.

Moreover, NXP Taiwan will add the capability of high-end product analysis and IC application development at its existing testing assembly site in Kaohsiung.




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