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Cypress introduces connectivity chips for 3G smart phones

Posted: 15 Sep 2006     Print Version  Bookmark and Share

Keywords:Cypress  MoBL More Battery Life  MoBL  dual ports  smart phones 

MoBL connectivity solutions for next-generation smart phones

Cypress Semiconductor Corp. added six new members to its family of asynchronous dual-port memory based inter-processor connectivity solutions for next-generation smart phones. The company said its More Battery Life (MoBL) dual ports are the first to integrate an address/data multiplexed (ADM) interface. This interface allows direct interconnect between application and baseband processors in 3G and 3.5G smart phones that are capable of video, music, games and other multimedia functions.

There is an increased consumer use of mobile phones for multimedia, data-organisation, Internet-access and entertainment purposes. These high bandwidth functions and the growing wireless pipeline (W-CDMA, HSDPA, WiMax) cause a tenfold increase in processing requirements for smart phones. To allocate enough dedicated I/Os for these functions, next generation processors have an ADM external memory interface to free address/data pins. The new devices enable direct interconnect with these application and baseband processors in dual-processor smart phones, resulting in reduced system costs and board space without external latches and faster and simpler design cycle, Cypress said.

"With a fixed ADM interface on one port and a selectable ADM or standard interface on the other port, MoBL ADM dual ports provide a comprehensive interconnect solution to 3G and 3.5G application and baseband processors," said Vikas Dhurka, product manager in Cypress's data communications division. "This allows handset designers to design dual-processor smart phones quickly without having to worry about different processor interfaces."

New multimedia functions and wireless standards call for a high-throughput, low-power interconnect in dual-processor mobile handsets. With access times of 65ns, MoBL ADM dual ports provide up to 246Mbps throughput, touted by Cypress as the highest in the industry. The technology enables interconnects to operate with 2μA standby current. It also offer 50 per cent power savings during inter-processor communication over traditional interconnects like UART, I²C and USB1.1 technology, the company explained.

The family of MoBL dual-port interconnects offers flexibility with its 64-, 128- and 256Kbit densities. Devices have up to 4Kbit memory space configurable in a x16 bus mode.

Moreover, members of the MoBL dual-port interconnect family are designed with two independent SRAM interfaces to allow processors to exchange data efficiently, enabling the baseband and application subsystems to evolve independent of each other. Each subsystem can be self-contained with minimal software design effort for interprocessor communication.

Available in 6-by-6mm, .5mm pitch 100-ball vfBGA packages, the devices are priced at $3.20 for 10,000-unit quantities.




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