Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > T&M
 
 
T&M  

SPEL opens leadless moulded package facility

Posted: 13 Sep 2006     Print Version  Bookmark and Share

Keywords:SPEL Semiconductor  package facility  expansion  India  K.C. Krishnadas 

IC assembly and tester SPEL Semiconductor Ltd has opened a Rs.23.39 crore ($5 million) leadless moulded package facility as part of a Rs.1,164.50 crore ($250 million) expansion plan. This facility will introduce new packaging techniques for small electronic devices.

According to the company, it plans to raise over Rs.931.6 crore ($200 million) in debt from Indian and global investors. It is targeting a revenue base of Rs.2,096.10 crore ($450 million) by 2011 through the packaging expansion.

"Building more advance semiconductor packages in India will stimulate the development of the semiconductor supply chain and eventually improve the core competencies of India's entire information technology industry," said Sam Varghese, SPEL CEO.

Global demand for leadless moulded packages is estimated to be 4 billion units. Vargehese said he expects demand to grow to 10 billion by 2011. SPEL will increase production from 252 million to over 5.6 billion units.

- K.C. Krishnadas
EE Times




Comment on "SPEL opens leadless moulded package ..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top