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Elpida plans to boost production at 300mm fab

Posted: 10 Jul 2006     Print Version  Bookmark and Share

Keywords:Elpida  300mm  fab  DRAM  wafer processing 

Elpida Memory Inc., a Japanese DRAM supplier, recently resolved at its board meeting a capital expenditure plan for increasing the manufacturing capacity of its 300mm wafer facility (E300 Fab) in Hiroshima Prefecture, Japan.

The company shared that the purpose for the capital expenditure is twofold: to respond to the growth in demand for DRAM products used in mobile devices; and to have production capacity for 70nm-and-below process technologies.

The fab is divided into several areas. The fab's Area 1 started construction in February 2001 and mass production in January 2003. Its Area 2 started construction in June 2004 and mass production in October 2005. Area 3 started construction at the same time as Area 2, but production has not yet been started. Half of Area 2 includes production facilities and equipment. At present, the combined wafer processing capacity for Area 1 and Area 2 is approximately 55,000 wafers per month.

Elpida plans to boost the wafer processing capacity to 60,000 wafers per month. After 60,000, the company said it will consider capacity expansion of up to 100,000 wafers by the end of its 2008 fiscal year.




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