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Packaging materials to hit Rs.53,136 crores in 2010

Posted: 25 Jan 2006     Print Version  Bookmark and Share

Keywords:semiconductor  packaging material  thermal interface material  SEMI  TechSearch International 

The market for semiconductor packaging materials, including thermal interface materials, is expected to grow from Rs.53,136 crores ($12 billion) in 2005 to Rs.83,346 crores ($19.5 billion) by 2010, according to a study by SEMI and TechSearch International.

According to the two companies, laminate substrates are the largest segment of the market, worth Rs.18597.60 crores ($4.2 billion) globally in 2005, and are projected to grow at a compound annual growth rate of 18 per cent over the next five years.

The report, titled "Global Semiconductor Packaging Materials Outlook - 2005 Edition," covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.

The report identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers.




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