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Manufacturing/Packaging  

New package for Teridian 73S8024RN interface now available

Posted: 17 Nov 2005     Print Version  Bookmark and Share

Keywords:teridian semiconductor  73s8024rn  smart card interface  20qfn 

line amplifier ICs

Teridian Semiconductor Corp. disclosed that they now offer their 73S8024RN smart card interface in the 20QFN package. This new package option, which has been approved by NDS Group plc, a supplier of open end-to-end digital pay TV solutions, for use with its Videoguard conditional access solution, will be one of the smallest IC of its type in the marketplace.

This new package choice will offer consumer electronic manufacturers a reduction in size of the IC, while meeting the requirements of NDS Videoguard," said Peter Yaxley, director of consumer devices at NDS. The 20QFN package option is possible due to the low-drop-out (LDO) regulator architecture of the chip, which results in a low-power dissipation compared to other solutions. The smart card voltage is generated by an on-chip LDO regulator instead of the traditional charge-pump DC/DC converter used by other similar circuits. As a result, said Teridian, the 73S8024RN die saves more than half a watt compared to other products.

The 73S8024RN 20QFN can also be used in payment and general-purpose smartcard applications. The chip offers full compliance with ISO7816 and EMV 4.0. The new 20QFN option makes the 73S8024RN even more suitable for applications where PCB space and cost are of concern, added the company.

The 73S8024RN is available for general sampling and volume production in the 20QFN package. This device also available in the 28SO and 32QFN package. In the new 20QFN option, pricing starts at $1 each in 10,000-unit quantities. A 20QFN-based demo board is also available for evaluation.




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