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Manufacturing/Packaging  

Preventing flip-chip solder joint failures

Posted: 01 Aug 2001     Print Version  Bookmark and Share

Keywords:acoustic imaging  flip chip  fcob  metallograph microscope  solder joint 

Learn about the degradation of solder joints in FCOBs as a result of thermal cycling. The article also seeks to answer how solder joint cracks are initiated and propagated.

View the PDF document for more information.



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