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Manufacturing/Packaging  

Assembling high-lead (Pb) DS2502 flip-chips in a Pb-free assembly flow

Posted: 08 Jun 2005     Print Version  Bookmark and Share

Keywords:pb-free  ds2502  flip-chip 

This app note details the Pb-free assembly process used, and the reliability stresses encountered after the assembly.

View the PDF document for more information.



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